Tufts University, Medford, MA                                                                                                                 2006 ~ 2008

      Department of Electrical and Computer Engineering

• M.S. in Electrical Engineering                                        GPA: 3.9/4.0

• Research Assistant in the Advanced Integrated Circuits and Systems Laboratory

Harbin Institute of Technology (HIT), Harbin, China                                                                              2002 ~ 2006

      Department of Microelectronic Science and Technology

• B.E. in Electronic Science and Technology                     GPA:90/100

• Analog / RF Integrated Circuits Design
• Analog Integrated Circuits for MEMS & Microsystems

Advanced Integrated Circuits and Systems Laboratory, School of Engineering, Tufts                               

Research Assistant                                                                                                                                     2006~2008 

• Designed a 10Gbit/s maximum ratio combining imaging diversity receiver system with front-end LNA, SNR detector and signal processing for FSO communication in IBM 90nm CMOS process. Chip submitted through TAPO.
• Designed a 6Gbit/s CMOS imaging diversity receiver front-end employing select-best combining method using IBM 180nm CMOS process.
• Designed a 750Mb/s CMOS capacitive feedback transimpedance amplifier with automatic gain control for optical wireless communication using AMI 0.5μm process and fabricated through MOSIS foundry.
• High frequency PCB development, test and measurement.  Modeling and simulation of optical wireless communication links using MATLAB, ZEMAX, Mathematica Optica.

MEMS Center, School of Astronautics, HIT                                                                                                  

State High Technology Development Program (863) of China, Student Researcher                               2005~2006

• Proposed an innovative configuration of a silicon-based micro direct methanol fuel cell (μDMFC) stack and was granted under “863 Program of China” projects. Completed the design, fabrication and measurement of the μDMFC stack. Filed a Chinese patent for this design.

• Yiling Zhang, Valencia Joyner, Shengling Deng, Zhaoran Huang, "A 6-Gbit/s CMOS Imaging Diversity Receiver Front-End Employing Select-Best Method," Accepted by IEEE International Midwest Symposium on Circuits and Systems, 2008.

• Yiling Zhang, Valencia Joyner, "An Analog Front-End Receiver with Desensitization to Input Capacitance for Free Space Optical Communication," Accepted by International Symposium on Communication Systems, Networks and Digital Signal Processing, 2008.

• Xiaochuan Tang, Yufeng Zhang, Yiling Zhang, Xiaowei Liu, "A Novel Direct Methanol Fuel Cell Stack Based on MEMS Technology," Submitted to International Symposium on Precision Mechanical Measurements, 2008.

• Yiling Zhang, Valencia Joyner, "Design and Analysis of a Capacitive Feedback Transimpedance Amplifier with Automatic Gain Control for Broadband Optical Wireless Links," To be submitted to IEEE Transactions on Circuits and Systems.

• Yufeng Zhang, Xiaochuan Tang, Xiaowei Liu, Yiling Zhang, "Design of a Silicon-Based Direct Methanol Fuel Cell Stack," Submitted to Chinese Journal of Mechanical Engineering.

• Xiaowei Liu, Yufeng Zhang, Chunguang Suo, Yiling Zhang, “Silicon-Based Planar Direct Methanol Fuel Cell Stack and Method of Fabrication”, Harbin Institute of Technology. Chinese Patent. Pending.

• IEEE student member

Download CV (PDF)